SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP | CIK:0001267482 | 3

  • Filed: 4/27/2018
  • Entity registrant name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL CORP (CIK: 0001267482)
  • Generator: Merrill
  • SEC filing page: http://www.sec.gov/Archives/edgar/data/1267482/000155837018003380/0001558370-18-003380-index.htm
  • XBRL Instance: http://www.sec.gov/Archives/edgar/data/1267482/000155837018003380/smi-20171231.xml
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  • ifrs-full:DescriptionOfAccountingPolicyForSharebasedPaymentTransactionsExplanatory

    Share-based payment arrangements

    Equity-settled share-based payments to employees and others providing similar services are measured at the fair value of the equity instruments at the grant date. Details regarding the determination of the fair value of equity-settled share-based transactions are set out in Note 39.

    The fair value determined at the grant date of the equity-settled share-based payments is expensed on a straight-line basis over the vesting period, based on the Group’s estimate of equity instruments that will eventually vest, with a corresponding increase in equity. At the end of each reporting period, the Group revises its estimate of the number of equity instruments expected to vest. The impact of the revision of the original estimates, if any, is recognized in profit or loss such that the cumulative expense reflects the revised estimate, with a corresponding adjustment to the equity-settled employee benefits reserve. When share options are exercised, the amount previously recognized in the reserve will be transferred to share premium.

    Equity-settled share-based payment transactions with parties other than employees are measured at the fair value of the goods or services received, except where that fair value cannot be estimated reliably, in which case they are measured at the fair value of the equity instruments granted, measured at the date the entity obtains the goods or the counterparty renders the service.